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Technical note · Cryogenics

Thermal management in a dilution refrigerator

Isha Chaudhary
Cryogenic Engineer
One Day Workshop on Dilution Refrigerator
TIFR, Colaba, Mumbai · August 2026

Dilution refrigerators are among the most powerful systems for reaching ultra-low temperatures in the millikelvin range. They use the phase separation and continuous circulation of ³He–⁴He mixtures to generate cooling, through multiple thermal stages and heat exchangers that progressively reduce the temperature of the circulating helium mixture.

That staged design creates a need for controllable thermal links: paths that provide high thermal conductance when a stage must be cooled, and thermal isolation when it must be left alone. This note looks at two elements of thermal management in the dilution refrigerator at the SRM University-AP quantum reference facility: the silver sintered heat exchanger in the mixing chamber, and a gas gap heat switch used to precool the dilution unit.

Schematic of a dilution refrigerator showing precooling, heat exchangers, still and mixing chamber
Schematic of the dilution unit, from the pulse-tube cold fingers through the still and heat exchangers to the mixing chamber.

The facility's insert follows the standard stage layout: a 300 K plate, a 50 K plate, a 4 K plate, the still, the cold plate and the mixing chamber.

Mixing chamber

Silver sintered heat exchanger

At millikelvin temperatures the thermal boundary resistance between a solid and liquid helium, the Kapitza resistance, becomes a dominant obstacle to heat transfer. A silver sintered heat exchanger addresses this by greatly increasing the contact surface area between the solid and liquid interface.

The effect is strongly temperature-dependent. The product ARKT³ is about 10⁻³ m² K⁴ W⁻¹ at 1 K and rises to about 3 × 10⁻² m² K⁴ W⁻¹ at 0.1 K, which is why the surface area of the sinter matters most at the coldest stage.

Silver sinter inside the mixing chamber
Model of the sintered heat exchanger structure
Silver sinter in the mixing chamber (left) and a model of the sintered structure (right).
Precooling

Gas gap heat switch

A gas gap heat switch is used to precool the dilution unit. It consists of two conducting copper blocks separated by a small gap. The gap is filled with a highly conducting gas, and changing the gas pressure switches the device between a high-conductance state and a low-conductance state.

The gap pressure is varied with a sorption pump. In the thermal model, a charcoal pump with a heater controls the gas pressure between a hot block and a cold block, which are held apart by a supporting rod.

Cut section view of the gas gap heat switch
Cut section view of the gas gap heat switch, showing the interleaved copper fins that form the gap.
Heat transfer

Three regimes, set by the Knudsen number

Heat transfer through the switch divides into three regions based on the Knudsen number, Kn. In the viscous regime (Kn < 0.1) the conductance follows the thermal conductivity of the helium gas. In the free molecular regime (Kn > 10) it scales with pressure and depends on the accommodation coefficient. Between them, in the transition regime (0.1 < Kn < 10), the effective conductance combines the two contributions in series.

Equations for conductance in the viscous, free molecular and transition regimes
Conductance expressions for the viscous, free molecular and transition regimes.
Numerical analysis

An ON/OFF ratio of about 12

Modelling the switch across charging pressures shows a clear molecular regime (the OFF state), a transition, and a viscous regime (the ON state). The analysis identifies the maximum charging pressure for the OFF state and the minimum charging pressure for the ON state.

0.016 W/K
OFF-state conductance
0.19 W/K
ON-state conductance
~12×
ON/OFF ratio
Thermal conductance versus gas charging pressure
Variation of thermal conductance with gas charging pressure in the gap.

With 2 W of cooling power, the simulation shows the still, cold plate and mixing chamber coming into thermal equilibrium and reaching 4 K in about 51 hours.

Precooling time of the still, cold plate and mixing chamber
Precooling time of all plates with 2 W of cooling power.
Why a gas gap switch

Advantages

No moving parts
Switching happens by gas adsorption, not mechanical actuation. The operation is vibration-free, which protects qubit coherence.
Wide ON/OFF ratio
A swing of about 12 in conductance gives fast cooldown without compromising isolation once the stage is cold.
Mechanically rigid
The support shell that isolates the gap also carries structural load and doubles as the mechanical link between stages.
Simple, reliable control
Pressure-based switching needs only a heater and a sorption pump, with no cryogenic motors or actuators to fail.
Low parasitic load when OFF
In the molecular regime the residual conductance is small, so an idle switch barely loads the cold stage.
References

Further reading

  1. Zhai, Yujia, and Haizheng Dang. “Performance optimization of a mK dilution refrigerator based on the first law of thermodynamics.” Cryogenics 135 (2023): 103731.
  2. Wang, Kun, et al. “Design and characterization of an alumina coated helium gas gap heat switch with adjustable gap width.” Cryogenics (2025): 104275.